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CommonChips.zip by aristarch Product ID: 333037
KEYWORDS: soldering chip package microchip DIL LQFP SOIC
CATEGORIES:  3D Models > Electronics
Some common soldered plastic packages, such as DIL, LQFP, SOIC.
Medium poly count.
Description
Some common soldered plastic packages, such as DIL, LQFP, SOIC.
Medium poly count, perfect for layout designing your own circuit boards.

All in correct millimeter scale. To get inch scale, convert to inches inside 3D Studio Max, or your 3D package.

Also provided: Two Photodiode types, a MOSFET DIL, and hall effect sensor.

3D Studio Max 5 file. Medium poly count.
3DS files provided.

Files:
DIL12.max
DIL16.max
DIL18.max
DIL20.max
DIL3_MOSFET.max
DIL8.max
HallEffectSensor.max
LQFP32.max
LQFP36.max
LQFP40.max
LQFP44.max
PhotoDiodes.max
SOIC10.max
SOIC12.max
SOIC14.max
SOIC16.max
SOIC8.max

Previews
No previews
$ 65.00
Available Delivery Formats:
Download Only
Available File Formats
3ds Max ( .max )
294 KB
3D Studio 4 ( .3ds )
276 KB
3ds Max 5 ( .max )
132 KB
Product Specifications
Media Type:3D Models
Published:Dec 9, 2006
Geometry:Polygonal
Polygons:0
Vertices:0
Textures:Yes
Materials:Yes
Jointed:Yes
Animated:No
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