High detailed 3d model of Suss MA/BA6 Gen3 tool.
The MA/BA8 Gen3 is the new benchmark in full-field lithography for MEMS, Advanced Packaging, 3D Integration and Compound Semiconductor markets.
Not a 100% accurate model, but as close as possible to achieve from images in open access.
Model made in real size. Dimensions are 1570 x 1214 x 1300 mm.
Originally modeled in 3ds Max 14/13, the model was exported to obj and fbx formats. The 3ds Max version comes with V-Ray materials.
Presentation images are raw renders. Images made using HDRI in lightning setup. HDRI is not included.